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Business Scope Product Wafer packaging and testing board
Wafer packaging and testing board

层数：26层

PCB尺寸：400*400mm

板材：高TG

板厚：6.5mm

铜厚：4 OZ

表面处理：沉金

最小线宽：4mil

最小线距：4mil

最小孔距：10mil

阻抗种类：4种

阻抗精度：±10%


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